Bonding wire for connecting pad and pin of chip, has outer and inner layers, where inner layer has high conductivity, low bending stiffness, low breaking load and low tensile strength than that of outer layers and wire is designed as tape

摘要

The wire (4) has outer layers (5, 7) and an inner layer (6) that are made of different materials. The outer and inner layers have different current bearing capacities and thickness. The inner layer has high conductivity, low bending stiffness, low breaking load and low tensile strength than that of the outer layers. The wire is designed as a tape and has a breadth ranging between 50 micrometer and 1 millimeter.