Electronic module for radiation sensor-component, has electronic components arranged in recess of printed circuit board as installation components such that electronic component do not project over board surface surrounding recess

摘要

The module (5) has electronic components (9-11), and a printed circuit board (6) is provided, on which the electronic components are supported. The printed circuit board is connected with the electronic components via bond wires. The electronic component is arranged in a recess (7) of the printed circuit board as an installation components such that the electronic components do not project over printed circuit board surface (12) surrounding the recess. An independent claim is also included for a method for manufacturing an electronic module.