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High voltage transistor integrated into CMOS logic structures for e.g. smart power technology, combines junction- and complementary metal oxide transistor structures

机译:高压晶体管集成到CMOS逻辑结构中,例如智能电源技术,结合了结型和互补型金属氧化物晶体管结构

摘要

The semiconducting substrate (1) includes a semiconducting zone (11) of first conductive type, with greater doping than the substrate, in a first lateral zone (111) of the substrate. A third semiconducting zone (3) of second, opposite conductive type, extends in the first zone (11) and is connected electrically to the source connection (S). This zone is spaced laterally from the substrate/first zone boundary. It borders the gate connection (G) laterally, but is insulated from it by a dielectric (9) layer. A fourth semiconducting zone (4) of the first type, extends inside the first zone (11) and is electrically connected to the source connection. Further fifth- (5), sixth- (6) and trenched- (20) zones of the structure are detailed.
机译:半导体衬底(1)在衬底的第一横向区域(111)中包括第一导电类型的半导体区域(11),该半导体区域的掺杂比衬底大。第二相反导电类型的第三半导体区域(3)在第一区域(11)中延伸并且电连接到源极连接(S)。该区域与衬底/第一区域边界横向隔开。它在侧面与栅极连接(G)接壤,但通过电介质(9)层与其绝缘。第一类型的第四半导体区(4)在第一区(11)内延伸并且电连接至源极连接。详细介绍了该结构的其他第五(5),第六(6)和沟槽(20)区。

著录项

  • 公开/公告号DE102006036295A1

    专利类型

  • 公开/公告日2008-02-14

    原文格式PDF

  • 申请/专利权人 INFINEON TECHNOLOGIES AG;

    申请/专利号DE20061036295

  • 发明设计人 GRATZ ACHIM;

    申请日2006-08-03

  • 分类号H01L29/78;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:47

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