Wafer-carrier arrangement for use during manufacturing e.g. diode, has carrier layer system with carrier layer, where adhesive strength between system and separation layer is greater than adhesive strength between wafer and separation layer

摘要

The arrangement has a plasma polymer separation layer (4) that is arranged between a carrier layer system and a wafer (1). The carrier layer system comprises a carrier layer (6), a plasma polymer layer and a hardened layer (5) that is made of a hardened elastomer material on a side of the separation layer. Adhesive strength between the carrier layer system and the separation layer is greater than the adhesive strength between the wafer and the separation layer. A connection material layer is provided on a side of the wafer, and another carrier layer has a foil. Independent claims are also included for the following: (1) an application of a layer from hardened elastomer material, a plasma polymer separation layer and/or a carrier layer system (2) a method for manufacturing a layer system (3) a method for manufacturing a wafer-carrier arrangement (4) a method for processing a rear side of a wafer.