Process for temperature-induced, material bonding of substrates comprising thermodynamically incompatible plastics, comprises adding adhesive-welding additive, joining substrate on a joining zone, heating the zone and obtaining substrates

摘要

Process for temperature-induced, material bonding of at least two substrates comprising thermodynamically incompatible plastics, comprises adding an adhesive-welding additive, which is identical with the substrates at least partially thermodynamically compatible or from the monomer structure, joining at least one of the substrate on a joining zone, and subsequently heating the joining zone, obtaining the substrates together after the end of the heating of a material-conclusive compound. An independent claim is included for an adhesive-welding additive, preferably for use in the process, comprising an adhesive-welding additive block copolymer, which is identical with the substrates thermodynamically compatible or from the monomer structure.