Spring contact for use in contact device for contacting semiconductor chip with electronic device, has contact section having sectional axis that coincides with tangent or passant to cladding surface, where surface covers spring extensively

摘要

The spring contact (1) has contact sections (11, 13) with contact points (12, 14), and a spring (15) arranged between the contact sections, such that the contact sections are subjected with a force component by the spring. The force component presses the contact sections apart. The contact section (11) exhibits a sectional axis (AF) at its contact point-sided end, and is movable along the sectional axis. The sectional axis coincides with a tangent or a passant to a cladding surface (H), where the surface covers the spring of the contact extensively.