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Semiconductor detector arrangement for use as back-illuminated multipin-photo detectors or charge coupled devices sensors, has multiple regions of semiconductor substrate spatial assigned to semiconductor structures

机译:用作背照式多针光检测器或电荷耦合器件传感器的半导体检测器装置具有多个空间分配给半导体结构的半导体衬底区域

摘要

The semiconductor detector arrangement (15) has multiple semiconductor structures, particularly photodiodes arranged on the front side of the substrate. The structures are connected with the support layer by electric contact and form multiple detectors (14) together with the substrate. Multiple regions of the semiconductor substrate are spatial assigned to semiconductor structures, and are separated partially from each other by separating grooves (16), so that charge carriers are prevented to reach from a region to another region of the substrate. An independent claim is also included for a manufacturing method for a semiconductor detector arrangement.
机译:半导体检测器装置(15)具有多个半导体结构,尤其是布置在衬底正面上的光电二极管。该结构通过电接触与支撑层连接,并且与基板一起形成多个检测器(14)。半导体衬底的多个区域在空间上分配给半导体结构,并且通过分离槽(16)彼此部分地分离,从而防止电荷载流子从衬底的一个区域到达另一个区域。还包括用于半导体检测器装置的制造方法的独立权利要求。

著录项

  • 公开/公告号DE102007007584A1

    专利类型

  • 公开/公告日2008-07-03

    原文格式PDF

  • 申请/专利权人 OSRAM OPTO SEMICONDUCTORS GMBH;

    申请/专利号DE20071007584

  • 发明设计人 MUELLER CHRISTIAN;KUHLMANN WERNER;

    申请日2007-02-15

  • 分类号H01L27/146;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:23

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