Film-forming composition, its preparation and application, its use for the direct removal of soiled and contaminated surfaces, which in particular have no preventive protective layers and application set containing this composition

摘要

Disclosed is a composition containing i) 5 wt .-% to 99 wt .-%, preferably 25 to 80 wt .-%, of at least one binder, ii) 1 wt .-% to 95 wt .-%, preferably 20 to 75% by weight, of at least one microencapsulated active substance, iii) 1% by weight to 10% by weight, preferably 3 to 7% by weight, based on the content of components i) and ii), of at least one auxiliary and / or additive, their preparation, their application and an application set.