首页> 外国专利> Three dimensional-structure representing method, involves presenting three dimensional-structure as individual volumetric grey scale value and as result of volumetric scans with set of cutting planes

Three dimensional-structure representing method, involves presenting three dimensional-structure as individual volumetric grey scale value and as result of volumetric scans with set of cutting planes

机译:三维结构表示方法,涉及将三维结构表示为单独的体积灰度值以及作为带有一组切割平面的体积扫描的结果

摘要

The method involves presenting a three dimensional (3-D)-structure as an individual volumetric grey scale value and as a result of volumetric scans with a set of cutting planes of medical tomograph. Changes of the 3-D-structure in a direction of a surface normal of the 3-D-structure with respect to a view direction of two dimensional (2-D)-projection images are characterized by the changes of the characteristics of represented 3-D-structure. The characteristics of the 3-D-structure are the patterning of the 3-D-structure.
机译:该方法涉及呈现三维(3-D)结构作为单个体积灰度值,以及作为使用医学断层扫描仪的一组切割平面进行体积扫描的结果。相对于二维(2-D)投影图像的观看方向,在3-D结构的表面法线方向上的3-D结构的变化通过所表示的3的特性的变化来表征。 -D结构。 3-D结构的特征是3-D结构的图案化。

著录项

  • 公开/公告号DE102007030960A1

    专利类型

  • 公开/公告日2008-01-31

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号DE20071030960

  • 发明设计人 DEINZER FRANK;

    申请日2007-07-04

  • 分类号G06T15/70;A61B19/00;A61B6/03;

  • 国家 DE

  • 入库时间 2022-08-21 19:49:12

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