Grinding device for long elongated wafer strip, has movable block with retainer body for supporting retaining unit for change of position about spherical retainer body, where movable block is movable parallel to flat grinding surface

摘要

The device (11) has a surface area (12) fixing a flat grinding surface (15), and a retaining unit (23) fixing a long elongated retaining surface for retaining an object. A movable block (16) has a spherical retainer body for supporting the retaining unit for change of position about the spherical retainer body, where the movable block is movablely designed parallel to the flat grinding surface. The long elongated retaining surface is bent about a predetermined angle of inclination relative to the flat grinding surface. Independent claims are also included for the following: (1) a grinding procedure (2) a mounting process of a workpiece.