A projected gimbal point drive system is disclosed. The projected gimbal point drive system includes a spindle (412) capable of apply a torque, and having a concave spherical surface formed on its lower portion. Further included is a wafer carrier disposed partially within the lower portion of the spindle (412). The wafer carrier (422) has a convex spherical surface (420) formed on a surface opposite the concave spherical surface (424) of the spindle. In addition, a drive cup is included that is disposed between the spindle and the wafer carrier. The drive cup (428) has a concave inner surface (430) and a convex outer surface (432), and allows the wafer carrier (422) to be tilted about a predefined gimbal point (418). In this manner, torque can be applied without affecting the gimbal action.
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