首页> 外国专利> Polymer layer e.g. photosensible resin layer, depositing method for e.g. microsystem device, involves removing non flat surface of support outside liquid mixture, and setting support in rotation at rotational speed for obtaining thickness

Polymer layer e.g. photosensible resin layer, depositing method for e.g. microsystem device, involves removing non flat surface of support outside liquid mixture, and setting support in rotation at rotational speed for obtaining thickness

机译:聚合物层光敏树脂层,沉积方法,例如微系统装置,包括除去液体混合物外部的支撑物的非平坦表面,并使支撑物以旋转速度旋转以获得厚度

摘要

The method involves installing a support e.g. substrate (2), above a liquid mixture (6) comprising a polymer or a precursor of the polymer, where a non flat surface (3) of the support is directed towards bottom in direction of the mixture. The non flat surface of the support is soaked in the mixture, and the surface outside the mixture is removed. The support is set in rotation at a predetermined rotational speed for obtaining a thickness. The surface of the support includes relief zones (3b), and predetermined thickness of a polymer layer (1) is uniform on the entire surface of the support.
机译:该方法包括安装支架,例如基材(2)在包含聚合物或聚合物前体的液体混合物(6)上方,其中载体的非平坦表面(3)在混合物的方向上朝向底部。将载体的非平坦表面浸入混合物中,并除去混合物外部的表面。支撑件以预定的旋转速度旋转以获得厚度。支撑体的表面包括凹凸区域(3b),并且聚合物层(1)的预定厚度在支撑体的整个表面上是均匀的。

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