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Polymer layer e.g. photosensible resin layer, depositing method for e.g. microsystem device, involves removing non flat surface of support outside liquid mixture, and setting support in rotation at rotational speed for obtaining thickness
Polymer layer e.g. photosensible resin layer, depositing method for e.g. microsystem device, involves removing non flat surface of support outside liquid mixture, and setting support in rotation at rotational speed for obtaining thickness
The method involves installing a support e.g. substrate (2), above a liquid mixture (6) comprising a polymer or a precursor of the polymer, where a non flat surface (3) of the support is directed towards bottom in direction of the mixture. The non flat surface of the support is soaked in the mixture, and the surface outside the mixture is removed. The support is set in rotation at a predetermined rotational speed for obtaining a thickness. The surface of the support includes relief zones (3b), and predetermined thickness of a polymer layer (1) is uniform on the entire surface of the support.
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