Heating cover placing method for e.g. office floor surface, involves integrating power supply units in thickness of insulating layer at locations of cuts to mask irregularity on resistive layer, and placing surface cover on resistive layer

摘要

The method involves placing a phonic and heat insulating layer (7) by covering a floor surface (3), and placing heat emitters (9) by covering a surface of the layer, where the layer is made of rubbery material. The layer is cut at specific locations corresponding to the position of power supply units of resistive layers (13) in the emitters. The power supply units are integrated in thickness of the insulating layer at the locations of rectangular and linear cuts for masking an irregularity on the resistive layer. A surface cover (11) is placed on the resistive layer. The surface cover is chosen among parquet, tiled floor, moquette and linoleum.