Heterogeneous electronic components e.g. resistor, interconnecting method for three dimensional electronic module, involves fritting pasty ink drops by laser to form electrical connections between superposed vias of wafers

摘要

The method involves depositing conductive ink drop (3) with solvents on each of metallized vias (1) of an electronic wafer (T1), where the ink has metal nano-particles such as silver, gold or copper. Another electronic wafer (T2) is stacked on the wafer (T1) such that metallized vias of the wafer (T2) are superposed on the vias of the wafer (T1). Solvents of 50 to 90 percentages are removed from the drop by heating/depression to obtain a pasty ink. Drops of the pasty ink are fritted by a laser e.g. yttrium-aluminum garnet laser, to form electrical connections between the superposed vias.