首页> 外国专利> MICROELECTRONIC MODULE WITH A DOUBLE COMMUNICATION INTERFACE, IN PARTICULAR FOR A CHIP CARD.

MICROELECTRONIC MODULE WITH A DOUBLE COMMUNICATION INTERFACE, IN PARTICULAR FOR A CHIP CARD.

机译:具有双通信接口的微电子模块,尤其是芯片卡。

摘要

The invention relates to a microelectronic module (7) with a dual contact and non-contact communication interface, in particular for a smart card, comprising on the one hand a substrate (13) provided with a terminal block formed by a set of electrical contacts ( 10) connected to a contact communication interface of a first electronic chip (21) and further comprising a main antenna (8) composed of at least one turn and whose terminals are connected to the communication interface without contact of a second electronic chip (22) .This microelectronic module is characterized in that it further comprises a resonant circuit (9) capable of channeling the electromagnetic flux received by the resonant circuit (9) towards the antenna main (8) of the module.L'invention is particularly applicable to the reliable and economical realization of smart card dual contact communication interface and contactless.
机译:具有双重接触和非接触通信接口的微电子模块(7),尤其涉及一种用于智能卡的微电子模块(7),该电子模块一方面包括基板(13),基板(13)具有由一组电触点形成的接线盒(10)连接至第一电子芯片(21)的接触式通信接口,并且进一步包括主天线(8),该主天线由至少一匝构成,并且其端子连接至通信接口而无需接触第二电子芯片(22)该微电子模块的特征在于,其还包括谐振电路(9),该谐振电路(9)能够将由谐振电路(9)接收的电磁通量引向模块的天线主干(8)。L'发明特别适用于智能卡双接触通信接口和非接触的可靠,经济的实现。

著录项

  • 公开/公告号FR2915010A1

    专利类型

  • 公开/公告日2008-10-17

    原文格式PDF

  • 申请/专利权人 SMART PACKAGING SOLUTIONS (SPS);

    申请/专利号FR20070002739

  • 发明设计人 PHILIPPE PATRICE;

    申请日2007-04-16

  • 分类号G06K19/077;

  • 国家 FR

  • 入库时间 2022-08-21 19:46:57

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