ALKOXYSILANE-MODIFIED POLYAMIDE RESIN, ITS MANUFACTURING METHOD, HOT MELT ADHESIVE, AND RESIN CURED ARTICLE

摘要

PROBLEM TO BE SOLVED: To provide an alkoxysilane-modified polyamide resin being excellent in heat resistance and mechanical strengths, its manufacturing method, a hot melt adhesive, and a resin cured article.;SOLUTION: The resin cured article obtained by curing the alkoxysilane-modified polyamide resin obtained by reacting a terminal isocyanate group-containing polyamide resin obtained by reacting a dimer acid with a polyisocyanate compound at a ratio that an isocyanate group becomes excessive relative to a carboxyl group with an alkoxysilane compound represented by general formula (1) is excellent in heat resistance and mechanical strengths. (Wherein R₁ represents a 1-20C alkylene group, R₂, R₃ and R₄ are the same or different from each other and represent a 1-20C alkoxy group or alkyl group, and at least one of R₂, R₃ and R₄ represents at least one alkoxy group).;COPYRIGHT: (C)2010,JPO&INPIT