首页> 外国专利> SURFACE-COATED CUTTING TOOL WITH HARD COATING LAYER FOR EXHIBITING EXCELLENT CHIPPING RESISTANCE AND ABRASION RESISTANCE BY HIGH-SPEED INTERMITTENT CUTTING WORK

SURFACE-COATED CUTTING TOOL WITH HARD COATING LAYER FOR EXHIBITING EXCELLENT CHIPPING RESISTANCE AND ABRASION RESISTANCE BY HIGH-SPEED INTERMITTENT CUTTING WORK

机译:具有硬涂层的表面涂层切削刀具,可通过高速间歇切削工艺表现出出色的耐切削性和耐磨性

摘要

PROBLEM TO BE SOLVED: To provide a surface-coated cutting tool for exhibiting excellent chipping resistance and abrasion resistance by high-speed intermittent cutting work.;SOLUTION: A hard coating layer composed of a modified Ti based carbonitride layer having an close adhesive Ti compound layer and a longitudinally growth crystal structure as a lower layer and an Al2O3 layer as an upper layer, is formed on a surface of a tool base body. The modified Ti based carbonitride layer indicates crystal orientation being 2-8 in both values of the ratio A/B and A/C of the total area A, the total area B and the total area C of respective crystal grains on which measured inclinations on a {112} surface, a {110} surface and a {111} surface fall within in a range of an inclination of 0-10 degrees to a normal of a surface polishing surface among the measured inclinations, by measuring the inclinations formed by the respective normals of the {112} surface, the {110} surface and the {111} surface being a crystal surface of the crystal grain to the normal of the surface polishing surface, by irradiating an electron beam to the individual crystal grains having a cubic crystal lattice existing in a measuring range of the surface polishing surface, by using a field emission type scanning electron microscope.;COPYRIGHT: (C)2009,JPO&INPIT
机译:要解决的问题:提供一种表面涂层的切削工具,该切削工具通过高速间歇切削工作表现出优异的耐崩刃性和耐磨性。;解决方案:一种硬涂层,该涂层由具有紧密粘合性的Ti化合物的改性Ti基碳氮化物层组成在工具基体的表面上形成层,并作为下部层的纵向生长晶体结构和作为上层的Al 2 O 3 层作为上部。改性的Ti基碳氮化物层表明,在总面积A,总面积B和总面积C的比值A / B和A / C的两个值上,晶体取向为2-8,在该晶粒上测量了倾角。通过测量由所形成的倾角,{112}表面,{110}表面和{111}表面相对于表面抛光表面的法线的倾斜度在0-10度的范围内。通过向具有立方晶格的单个晶粒照射电子束,使{112}表面的各个法线,{110}表面和{111}表面的晶粒相对于表面抛光表面的法线成为晶体表面。使用场发射型扫描电子显微镜在表面抛光表面的测量范围内存在的晶格。版权所有:(C)2009,JPO&INPIT

著录项

  • 公开/公告号JP2009166195A

    专利类型

  • 公开/公告日2009-07-30

    原文格式PDF

  • 申请/专利权人 MITSUBISHI MATERIALS CORP;

    申请/专利号JP20080008660

  • 发明设计人 NISHIYAMA MANYASU;NAKAMURA KEIJI;

    申请日2008-01-18

  • 分类号B23B27/14;B23C5/16;C23C16/32;C23C16/34;C23C16/36;

  • 国家 JP

  • 入库时间 2022-08-21 19:44:43

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