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TANTALUM CAPACITOR, AND MANUFACTURING METHOD OF TANTALUM CAPACITOR

机译:钽电容器及钽电容器的制造方法

摘要

PPROBLEM TO BE SOLVED: To provide: a small tantalum capacitor suppressing complication of a manufacturing process and excelling in high-frequency performance; and a manufacturing method of the tantalum capacitor. PSOLUTION: This tantalum capacitor includes: a plurality of tantalum sintered bodies in which first surfaces of the respective tantalum sintered bodies form the same surface, and the respective tantalum sintered bodies are arranged by being spaced apart from each other; a plurality of electrode rods projecting from the first surfaces of the respective tantalum sintered bodies; layers consisting of an oxide film layer, a functional polymer layer or a manganese layer, and a carbon layer which are sequentially laminated on surfaces of the plurality of tantalum sintered bodies excluding the first surfaces; a conductive layer which covers outside surfaces of the plurality of tantalum sintered bodies excluding the first surfaces; and an electrode plate having openings respectively formed at positions facing the respective first surfaces of the plurality of tantalum sintered bodies for exposing the electrode rods therethrough, and connected to the conductive layer by spreading across the first surfaces of the plurality of tantalum sintered bodies. PCOPYRIGHT: (C)2010,JPO&INPIT
机译:

要解决的问题:提供:一种小型钽电容器,可抑制制造过程的复杂性并提高高频性能;以及钽电容器的制造方法。

解决方案:该钽电容器包括:多个钽烧结体,其中各个钽烧结体的第一表面形成相同的表面,并且各个钽烧结体彼此间隔地布置;从各个钽烧结体的第一表面突出的多个电极棒;在多个钽烧结体的除第一表面以外的表面上依次层叠有由氧化膜层,功能性聚合物层或锰层以及碳层构成的层。导电层覆盖多个钽烧结体的除第一表面之外的外表面;电极板,其具有分别在面对多个钽烧结体的各个第一表面的位置处形成的开口,以使电极棒从中露出,并且通过散布在多个钽烧结体的第一表面上而与导电层连接。

版权:(C)2010,日本特许厅&INPIT

著录项

  • 公开/公告号JP2009224669A

    专利类型

  • 公开/公告日2009-10-01

    原文格式PDF

  • 申请/专利权人 FUJITSU LTD;

    申请/专利号JP20080069359

  • 发明设计人 ITO MASAYUKI;

    申请日2008-03-18

  • 分类号H01G9/00;H01G9/012;

  • 国家 JP

  • 入库时间 2022-08-21 19:43:42

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