SILICON-CONTAINING FILM-FORMING COMPOSITION, SILICON-CONTAINING FILM, SILICON-CONTAINING FILM-FORMING SUBSTRATE AND PATTERNING METHOD USING THE SAME

摘要

PPROBLEM TO BE SOLVED: To provide a heat-cured silicon-containing film-forming composition that forms an excellent pattern by using a formed silicon-containing intermediate film and ensures effective transfer of a photoresist pattern and accurate processing of a substrate. PSOLUTION: The heat-curable silicon-containing film-forming composition comprises (A-1) a silicon-containing compound obtained through hydrolytic condensation of a hydrolyzable silicon compound in the presence of an acid catalyst, (A-2) a silicon-containing compound obtained through hydrolytic condensation of a hydrolyzable silicon compound in the presence of a base catalyst, (B) a compound represented by the formula (1): LSBa/SBHSBb/SBX (wherein L is Li, Na, K, Rb or Ce; X is a hydroxy group or an organic acid group; a is 1; and b is 0 or 1) or a compound represented by the formula (2): MSBa/SBHSBb/SBA (wherein M is sulfonium, iodonium or ammonium; and A is the X or a nonnucleophilic counter ion), (C) an organic acid, (D) an alcohol containing a cyclic ether as a substituent group and (E) an organic solvent. PCOPYRIGHT: (C)2009,JPO&INPIT