SUBSTRATE HEATING METHOD, SUBSTRATE HEATING APPARATUS, MANUFACTURING METHOD OF PIEZOELECTRIC ELEMENT, AND MANUFACTURING METHOD OF LIQUID INJECTION HEAD

摘要

PROBLEM TO BE SOLVED: To provide a substrate heating method and a substrate heating apparatus capable of uniformly heating the entire surface of a substrate.;SOLUTION: A film is formed on the substrate. When placing the substrate on which the film is formed on a hot plate for heating, the surface of the hot plate should be convex or concave. The substrate is heated while the interval between the substrate warped by heating and the surface of the hot plate is nearly constant in a direction parallel to the substrate.;COPYRIGHT: (C)2009,JPO&INPIT