Being the housing which designates the lead/read frame as the base and the housing which designates, the lead/read frame for

摘要

A leadframe-based housing for a surface-mountable component, particularly a radiation-emitting component. The leadframe-based housing comprises electrical connector strips and at least one chip mounting area. One of the connector strips includes an injection aperture that enables a leadframe-based housing to be produced with a very small thickness in an injection molding process. A method for producing such housings is further specified.