首页> 外国专利> METHOD OF MANUFACTURING SURFACE BLACKENED COPPER METAL, METHOD OF MANUFACTURING BASE MATERIAL WITH CONDUCTOR LAYER PATTERN, BASE MATERIAL WITH CONDUCTOR PATTERN, AND ELECTROMAGNETIC WAVE SHIELDING MEMBER USING THE BASE MATERIAL

METHOD OF MANUFACTURING SURFACE BLACKENED COPPER METAL, METHOD OF MANUFACTURING BASE MATERIAL WITH CONDUCTOR LAYER PATTERN, BASE MATERIAL WITH CONDUCTOR PATTERN, AND ELECTROMAGNETIC WAVE SHIELDING MEMBER USING THE BASE MATERIAL

机译:表面黑铜金属的制造方法,具有导体层图案的基体材料的制造方法,具有导体图案的基体材料的制造以及使用该基础材料的电磁波屏蔽构件

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a copper metal layer whose surface is blackened with good mass-productivity.;SOLUTION: In the method of manufacturing a pattern copper metal layer whose surface is blackened using a conductive base material 1 for plating, the conductive base material 1 for plating has an insulating layer 3 formed on a surface of a conductive base material 2 and also has a pattern of a recessed portion 4 which is wide in an opening direction and for forming plating, formed in the insulating layer 3. Following steps are carried out in one copper pyrophosphate plating bath, a conductive layer forming step of forming the copper metal layer by depositing copper metal in the recessed portion 4 of the conductive base material 1 for plating with first current density, and a blackening processing step of depositing copper metal on a surface of the copper metal layer with second current density larger than the first current density so that the surface may become black.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种制造具有良好批量生产性的表面变黑的铜金属层的方法;解决方案:在使用电镀用导电基材1制造表面变黑的图案化铜金属层的方法中镀敷用导电性基材1具有在导电性基材2的表面上形成的绝缘层3,并且在该绝缘层中形成有在开口方向上较宽且形成镀层的凹部4的图案。 3.在一个焦磷酸铜电镀液中进行以下步骤,以及通过以第一电流密度将铜金属沉积在用于电镀的导电基材1的凹入部分4中来形成铜金属层的导电层形成步骤,并进行黑化处理。处理步骤,在第二电流密度大于第一电流密度的铜金属层的表面上沉积铜金属,以使表面y变黑。;版权所有:(C)2009,JPO&INPIT

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