TEMPERATURE COMPENSATING DEVICE TO MAIN BODY WHICH HAS HEAT LOAD OF LOW THERMAL CONDUCTIVITY

摘要

PROBLEM TO BE SOLVED: To provide a device with a small risk of thermal deformation in heat distribution inside a main body, which receives heat load, while deterioration in effect of low thermal expansion coefficient can be prevented, with respect to a temperature compensating device to the main body, which has a heat load made of specific low thermal conductivity material.;SOLUTION: A thermal distribution device having one or more thermal distribution objects is jointed to a surface of a main body, which has the heat load, in a way that there is a gap 18 between the main body 1 and a thermal distribution object 11. In relation to mechanical isolation, the gap is filled with fluid 17 for thermal coupling to the main body, which receives the heat load to conduct thermal distribution.;COPYRIGHT: (C)2009,JPO&INPIT