首页> 外国专利> MANUFACTURING METHOD OF ELECTRONIC CONTROL UNIT, CONNECTOR AND ELECTRONIC CONTROL UNIT MANUFACTURED BY THE MANUFACTURING METHOD OF THE ELECTRONIC CONTROL UNIT

MANUFACTURING METHOD OF ELECTRONIC CONTROL UNIT, CONNECTOR AND ELECTRONIC CONTROL UNIT MANUFACTURED BY THE MANUFACTURING METHOD OF THE ELECTRONIC CONTROL UNIT

机译:电子控制单元的制造方法,由电子控制单元的制造方法制造的连接器和电子控制单元

摘要

PROBLEM TO BE SOLVED: To reduce stress generated at the soldered part of a wiring board and terminals due to the warp of the wiring board housed inside a case body.;SOLUTION: The manufacturing method of the electronic control unit 100 provided with the wiring board 2 where an electronic component 3 is mounted, a connector 4 including the plurality of terminals 41 and a housing 42, for which the terminals 41 are to be soldered on the wiring board 2, and a case body 5 for holding the wiring board 2 particularly includes a first step of soldering the respective terminals 41 of the connector 4 onto the wiring board 2 and a second step of housing the wiring board 2 and the plurality of connectors 4 integrated by the soldering inside the case body 5. In the first process, the terminals 41 and the wiring board 2 are soldered while applying loads for preventing the warp of the wiring board 2 to the wiring board 2. In the second step, the wiring board 2 is held by the case body 5 in the state of restraining the wiring board 2 so as to correct the warp.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:为了减少由于容纳在壳体内的布线板的翘曲而在布线板和端子的焊接部分产生的应力。解决方案:具有该布线板的电子控制单元100的制造方法参照图2,其中安装有电子部件3;连接器4,其包括多个端子41和壳体42,用于将端子41焊接在配线基板2上的壳体42;以及用于保持配线基板2的壳体5。包括将连接器4的各个端子41焊接到布线板2上的第一步骤,以及通过焊接将布线板2和多个连接器4容纳在壳体5内部的第二步骤。端子41和配线基板2在施加负荷的同时被焊接,以防止配线基板2翘曲到配线基板2上。在第二步骤中,配线基板2被保持在壳体5的状态下。 f约束接线板2以纠正翘曲。版权所有:(C)2009,JPO&INPIT

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