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GaN-BASED LED CHIP AND LIGHT-EMITTING DEVICE

机译:GaN基LED芯片和发光器件

摘要

PROBLEM TO BE SOLVED: To provide a light-emitting device that can be used suitably as an excitation light source of a white light-emitting device for illumination and has improved luminous output by improving the output of the light-emitting device where a GaN-based LED chip is subjected to flip-chip packaging.;SOLUTION: The light-emitting device is configured by flip-chip packaging a GaN-based LED chip described in a passage (A). (A) The GaN-based LED chip 100 is provided with a translucent substrate 101, and a GaN-based semiconductor layer L formed on the translucent substrate 101. The GaN-based semiconductor layer L has a stacked structure which includes an n-type layer 102, a luminous layer 103, and a p-type layer 104 in this order from the side of the translucent substrate 101. On the p-type layer 104, a positive electrode E101, which is composed of a translucent electrode E101a made of an oxide semiconductor and a positive contact electrode E101b electrically connected to the translucent electrode, is formed. The area of the positive contact electrode E101b is less than a half of the area of the upper surface of the p-type layer 104.;COPYRIGHT: (C)2009,JPO&INPIT
机译:要解决的问题:提供一种发光器件,该发光器件可以适当地用作照明用白色发光器件的激发光源,并且可以通过改善GaN-解决方案:发光器件通过倒装芯片封装在段落(A)中所述的GaN基LED芯片来配置。 (A)GaN基LED芯片100具备:透光性基板101;和在该透光性基板101上形成的GaN基半导体层L。GaN基半导体层L具有包括n型的层叠结构。从透光性基板101的侧面开始依次形成层102,发光层103和p型层104。在p型层104上,由由透光性电极E101a构成的正极E101构成为形成氧化物半导体和电连接至半透明电极的正接触电极E101b。正接触电极E101b的面积小于p型层104上表面面积的一半。版权所有:(C)2009,JPO&INPIT

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