Lead/read forma electronic parts implemental printed circuit board, manner of solder attaching the lead/read forma electronic parts, air conditioner.

摘要

PROBLEM TO BE SOLVED: To obtain a lead-type electronic component packaging printed wiring board which does not generate solder bridge when one side of the lead-type electronic component is soldered by a jet flow solder bath, especially in the case of a narrow pitch between leads or the like.;SOLUTION: In a printed wiring board 1, a lead-type electronic component 2 with a plurality of leads 2a is packaged. It has a continuous soldered land group 3 of a lead-type electronic component 2, and the lead-type electronic component 2 is packaged by soldering. A soldered land 4 with a cross-shaped slit 4a is provided adjacent to the rear of the continuous soldered land group 3.;COPYRIGHT: (C)2007,JPO&INPIT