Test board used for a reliability test and reliability test method

摘要

To conduct a reliability test for a tape automated bonding (TAB) package under a state being close to a mounting state to a product, the TAB package (1) includes a TAB tape (3), a semiconductor chip (2) mounted on the TAB tape (3), and a first terminal (7a) and a second terminal (7b) formed on both end portions of the TAB tape (3), electrically connected to the semiconductor chip (2) through wiring. A test board (10) used for the reliability test for the TAB package (1) includes a substrate (20), a pair of holding members (30-1, 30-2) provided on the substrate 20 so as to face with each other for holding the respective both end portions of the TAB package (1), holding portion terminals each provided to each of the pair of holding members (30-1, 30-2) so as to have a contact with each of the first terminal (7a) and the second terminal (7b). A distance (L2) between the pair of holding members (30-1, 30-2) is shorter than a distance (L1) between the first terminal (7a) and the second terminal (7b) along a surface of the TAB package (1).