SEMICONDUCTOR DIE PACKAGES SUITABLE FOR OPTOELECTRONIC APPLICATIONS HAVING CLIP ATTACH STRUCTURES FOR ANGLED MOUNTING OF DICE

摘要

An optocoupler package is disclosed. The package includes a substrate comprising a substrate surface, a first device, and a clip structure attached to the first device. The clip structure and the first device are mounted on the substrate, and the first device is oriented at an angle with respect to the substrate surface. A second device is mounted on the substrate, where the first device is capable of communicating with the second device.