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Optimized power delivery to high speed, high pin-count devices
Optimized power delivery to high speed, high pin-count devices
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机译:优化向高速,高引脚数设备的功率传输
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摘要
A high-speed semiconductor device includes a substrate having an upper substrate surface, a lower substrate surface, and a periphery bounding the upper and the lower substrate surfaces, the substrate further having an upper substrate ground trace providing an electrical path to the lower substrate surface through a substrate ground via; an array of solder balls attached to the lower substrate surface, the array of solder balls including a plurality of ground solder balls disposed at the periphery and electrically connected to the substrate ground via.
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