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Low VOC-solvent based mold release agent and curable mold release compositions based thereon
Low VOC-solvent based mold release agent and curable mold release compositions based thereon
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机译:低VOC溶剂型脱模剂和基于其的可固化脱模剂组合物
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摘要
The present invention relates to curable mold release compositions containing a non-volatile organic (non-VOC), or low-volatile organic (low-VOC), component employed as a carrier for a curable component. When applied as a coating the mold release compositions cure to a finish having a high durability that is sustained throughout multiple releases.
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