首页> 外国专利> A method of connecting the connection between two pipes to the ground. There is a multi-layer wall structure between the two pipes, which includes at least one pipe layer, a non-conductive layer covering the outer side of the pipe; and the pipe obtained

A method of connecting the connection between two pipes to the ground. There is a multi-layer wall structure between the two pipes, which includes at least one pipe layer, a non-conductive layer covering the outer side of the pipe; and the pipe obtained

机译:一种将两个管道之间的连接连接到地面的方法。在两个管之间存在多层壁结构,该结构包括至少一个管层,覆盖该管的外侧的非导电层。和获得的管道

摘要

1. The method of connecting the pipes of two multilayer wall structures to the ground, the two pipes have at least one conductive layer, which is covered by a non-conductive layer located outside the conductive layer; And at least one layer of conduit for pipes containing multiple layers of pipes
机译:1.将两个多层壁结构的管道连接到地面的方法,两个管道具有至少一个导电层,该导电层被位于导电层外部的非导电层覆盖;至少有一层管道用于包含多层管道的管道

著录项

  • 公开/公告号CL2008002016A1

    专利类型

  • 公开/公告日2009-08-07

    原文格式PDF

  • 申请/专利权人 OY KWH PIPE AB;

    申请/专利号CL20080002016

  • 发明设计人 BONDEN ADRIAN;JANSSON PATRICK;HOLM ALF;

    申请日2008-07-10

  • 分类号B29C65/06;B29C65/34;B32B1/08;B32B27/00;F16L25/01;F16L47/03;F16L9/133;H01R13/00;B29L23/00;B29L9/00;

  • 国家 CL

  • 入库时间 2022-08-21 19:28:19

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