This invention refers to a new method for the improvement of seeds germination and plants resistance under stress conditions, achieved with the use of type 1 compound solutions. Where X may be H, OH, CH3, OCOCH3 etc, R1 may be H, CH3, CH3CH2, CH3CH2CH2 etc and R2 may be H, CH3, CH3CH2, CH3CH2CH2 etc. The desirable results are achieved by spraying, soaking or watering the seeds with solutions of type 1 compounds at a quantity from 0.01 to 100 ppm and especially from 0.05 to 5 ppm.
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