首页> 外国专利> A KIND OF THERMOELECTRIC SEMICONDUCTOR AIR CONDITIONING FOR REFRIGERATING AND HEATING

A KIND OF THERMOELECTRIC SEMICONDUCTOR AIR CONDITIONING FOR REFRIGERATING AND HEATING

机译:一类用于制冷和供暖的热电偶空调

摘要

A kind of thermoelectric semiconductor air conditioning for refrigerating and heating, which does not use air compressor, includes a casing (1), a DC regulated power supply (2) and a thermoelectric semiconductor refrigerating plate (3), which is connected with the DC regulated power supply (2). The cold pole face of the thermoelectric semiconductor refrigerating plate (3) is connected with a heat exchanging tank (4), and the water outlet of the heat exchanging tank (4) sequentially is connected with a high pressure pump (5), a capillary tube (6) and an evaporator (7). The water outlet of the evaporator (7) is connected with the water inlet of the heat exchanging tank (4), and behind the evaporator (7), there is an exhaust blower (8). The hot pole face of the thermoelectric semiconductor refrigerating plate (3) is connected with a blower (10), an exhaust pipe (11) and a heat sink (9). In winter, the hot pole face of the thermoelectric semiconductor refrigerating plate (3) is connected with the heat exchanging tank (4), and then the air conditioning could heat room air.
机译:一种不使用空气压缩机的制冷制热热电半导体空调,包括壳体(1),直流稳压电源(2)和与直流电相连的热电半导体制冷板(3)。稳压电源(2)。热电半导体制冷板(3)的冷极面与热交换槽(4)连接,热交换槽(4)的出水口依次与高压泵(5),毛细管连接。管(6)和蒸发器(7)。蒸发器(7)的出水口与换热箱(4)的进水口相连,在蒸发器(7)的后面设有排气鼓风机(8)。热电半导体制冷板(3)的热极面与鼓风机(10),排气管(11)和散热器(9)连接。在冬天,将热电半导体制冷板(3)的热极面与热交换箱(4)连接,然后空调可以加热室内空气。

著录项

  • 公开/公告号WO2009018741A1

    专利类型

  • 公开/公告日2009-02-12

    原文格式PDF

  • 申请/专利权人 WANG ZHIPING;

    申请/专利号WO2008CN71686

  • 发明设计人

    申请日2008-07-18

  • 分类号F24F5/00;F25B21/02;

  • 国家 WO

  • 入库时间 2022-08-21 19:20:36

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