首页> 外国专利> Method of mounting condenser microphone on main PCB and condenser microphone adapted for the same

Method of mounting condenser microphone on main PCB and condenser microphone adapted for the same

机译:在主PCB上安装电容式麦克风的方法以及适用于该电容式麦克风的电容式麦克风

摘要

A condenser microphone (400) and a method of mounting a condenser microphone on a main PCB (200) are provided. The method includes the steps of: assembling the condenser microphone (400) by assembling elements of the condenser microphone such that a vibration plate including a couple of a diaphragm (412) and a backplate (408) is directed toward an opened surface of a casing (402) of the condenser microphone (400), the casing having a closed bottom surface and an opened surface opposite to the closed bottom surface, mounting a PCB (418) having a sound hole (418a) on the casing (402) and curling the opened surface of the casing such that a connecting terminal (420, 422) of the PCB is protruded compared to a curled surface; positioning the assembled condenser microphone (400) on a main PCB (200) such that the sound hole (418 a) of the PCB (418) of the condenser microphone is in accordance with a through hole (202) formed in the main PCB (200); and soldering the connecting terminal (420, 422) of the condenser microphone to a land of the main PCB. According to the present invention, if necessary, the main PCB can be mounted such that its elements surface is directed toward an inside of an electronic product, thereby maintaining good sound quality thanks to a short delivery path of sound wave.
机译:提供了电容式麦克风(400)和将电容式麦克风安装在主PCB(200)上的方法。该方法包括以下步骤:通过组装电容式麦克风的元件来组装电容式麦克风(400),使得包括一对膜片(412)和背板(408)的振动板指向壳体的敞开表面。电容麦克风(400)的(402),壳体具有封闭的底表面和与封闭的底表面相对的开放表面,将具有音孔(418a)的PCB(418)安装在壳体(402)上并卷曲壳体的敞开表面,使得PCB的连接端子(420,422)与卷曲表面相比突出。将组装好的电容式麦克风(400)放置在主PCB(200)上,以使电容式麦克风的PCB(418)的音孔(418a)与形成在主PCB(200)中的通孔(202)一致200);然后将电容式麦克风的连接端子(420、422)焊接到主PCB的焊盘上。根据本发明,如果需要,可以安装主PCB,使得其元件表面指向电子产品的内部,从而由于声波的短传递路径而保持良好的音质。

著录项

  • 公开/公告号EP1530401A3

    专利类型

  • 公开/公告日2009-05-06

    原文格式PDF

  • 申请/专利权人 BSE CO. LTD.;

    申请/专利号EP20040011879

  • 发明设计人 SONG CHUNG-DAM;CHUNG EEK-JOO;KIM HYUN-HO;

    申请日2004-05-19

  • 分类号H04R19;H04R1/08;

  • 国家 EP

  • 入库时间 2022-08-21 19:18:40

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号