METHOD FOR BONDING RESIN BY VACUUM ULTRAVIOLET IRRADIATION, PROCESS FOR PRODUCING RESIN ARTICLE OR MICROCHIP USING THE METHOD, AND RESIN ARTICLE OR MICROCHIP PRODUCED BY THE PROCESS.

摘要

Disclosed is a method for bonding resins to each other with high productivity at a temperature below a temperature necessary for bonding by heat sealing. The method for binding resins to each other is a method for bonding a first resin (1) and a second resin (2) to each other. The method comprises a step (I) of irradiating a space (10) containing oxygen molecules in contact with surfaces (3a, 3b) of the first and second resins with vacuum ultraviolet light having a wavelength of not more than 175 nm and a step (II) of raising the temperature in such a state that the surfaces (3a, 3b) after the irradiation are in contact with each other, to bond the first resin (1) and the second resin (2) to each other using the surfaces (3a, 3b) as bonding surfaces. In step (I), the surfaces (3a, 3b) of the first and second resins may be further irradiated with vacuum ultraviolet light. In this case, the light intensity of the vacuum ultraviolet light which reaches the surfaces (3a, 3b) is preferably, for example, not less than 0.1 J/cm2 and not more than 10 J/cm2.