ULTRASHORT PULSE LASER APPLICATIONS

摘要

The invention relates to methods of processing biological tissue using an ultrashort pulse (USP) laser. In one embodiment, the invention relates to a method of separating transverse layers or portions of a biological tissue using USP laser. In an alternative embodiment, the invention relates to a method of cutting biological tissue using USP laser. In another embodiment, the invention relates to a method of removing unwanted material from the surface of a biological tissue comprising application of the USP laser to the tissue surface.