as a main component.;It also relates to a photosemiconductor device comprising a photosemiconductor element encapsulated with the epoxy resin composition.;The epoxy resin composition can be cured by heating, thereby obtaining a cured product having excellent moisture and heat resistance and transparency."/>
Process for producing epoxy compound, epoxy resin composition and use thereof, ultraviolet-curable can coating composition, and process for producing coated metal can§
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Process for producing epoxy compound, epoxy resin composition and use thereof, ultraviolet-curable can coating composition, and process for producing coated metal can§
Process for producing epoxy compound, epoxy resin composition and use thereof, ultraviolet-curable can coating composition, and process for producing coated metal can§
The invention relates to a liquid epoxy resin composition containing an alicyclic epoxy compound of formula Ias a main component.;It also relates to a photosemiconductor device comprising a photosemiconductor element encapsulated with the epoxy resin composition.;The epoxy resin composition can be cured by heating, thereby obtaining a cured product having excellent moisture and heat resistance and transparency.
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机译：本发明涉及包含式I的脂环族环氧化合物的液体环氧树脂组合物 <图像文件=“ IMGA0001.GIF” he =“ 37” id =“ ia01” imgContent =“ chem” imgFormat =“ GIF” wi =“ 72” /> 本发明还涉及包含封装有环氧树脂组合物的光半导体元件的光半导体器件。所述环氧树脂组合物可以通过加热而固化，从而获得具有优异的耐湿热性和透明性的固化物。
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