首页> 外国专利> Reducing the consumption of process gases during chemical gas phase separation of silicon layers during which hydrogen is produced in addition to the separating layer as a reaction product

Reducing the consumption of process gases during chemical gas phase separation of silicon layers during which hydrogen is produced in addition to the separating layer as a reaction product

机译:减少硅层化学气相分离过程中工艺气体的消耗,在分离过程中除了分离层外还产生氢气作为反应产物

摘要

The method for the reduction of process gas consumption in chemical gas phase deposition of silicon containing layer, which emerges primary hydrogen as reaction product for thin film solar module, comprises selectively removing hydrogen from a system for chemical gas phase deposition. The process gas that is not yet reacted remains in the system and is recirculated from the gas outlet of process chamber (24) to gas inlet (8) of the process chamber. The hydrogen is removed from the system by a hydrogen permeable membrane (31). The method for the reduction of process gas consumption in chemical gas phase deposition of silicon containing layer, which emerges primary hydrogen as reaction product for thin film solar module, comprises selectively removing hydrogen from a system for chemical gas phase deposition. The process gas that is not yet reacted remains in the system and is recirculated from the gas outlet of process chamber (24) to gas inlet of the process chamber. The hydrogen is removed from the system by a hydrogen permeable membrane (31), which is present in gas pipeline system behind the gas outlet of the process chamber. The system for chemical gas deposition is a system by which low pressure is present in the process chamber (low pressure chemical vapor deposition) and is a deposition system reinforcing plasma (plasma enhanced chemical vapor deposition).
机译:用于减少含硅层的化学气相沉积中的处理气体消耗的方法,该方法产生初级氢作为薄膜太阳能电池组件的反应产物,该方法包括从用于化学气相沉积的系统中选择性地除去氢。尚未反应的过程气体保留在系统中,并从过程室(24)的气体出口再循环到过程室的气体入口(8)。氢通过氢可渗透膜(31)从系统中除去。用于减少含硅层的化学气相沉积中的处理气体消耗的方法,该方法产生初级氢作为薄膜太阳能电池组件的反应产物,该方法包括从用于化学气相沉积的系统中选择性地除去氢。尚未反应的过程气体保留在系统中,并从过程室(24)的气体出口再循环到过程室的气体入口。氢通过氢可渗透膜(31)从系统中除去,该氢可渗透膜存在于处理室气体出口后面的气体管道系统中。化学气体沉积系统是在处理室中存在低压的系统(低压化学气相沉积),并且是增强等离子体的沉积系统(等离子体增强化学气相沉积)。

著录项

  • 公开/公告号EP2045358A2

    专利类型

  • 公开/公告日2009-04-08

    原文格式PDF

  • 申请/专利权人 NAEBAUER ANTON;

    申请/专利号EP20080015374

  • 发明设计人 NAEBAUER ANTON;

    申请日2008-09-03

  • 分类号C23C16/44;C23C16/455;

  • 国家 EP

  • 入库时间 2022-08-21 19:15:53

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