Method of Measuring the Thickness of Thin Film Layer on Curved Substrate Using Infrared Thermal Image System

摘要

The present invention relates to a method of measuring the thickness of a thin film layer using an infrared thermal imaging system. The object of the present invention is to provide a method of measuring the thickness of a thin film layer fast in such a way as to obtain the two-dimensional (2-D) thickness distribution of the thin film layer at one time by measuring infrared spontaneous light emitted from a target surface using an infrared imaging camera. The present invention includes a means for measuring the thickness of a thin film coated on a flat base surface, which outputs the thickness of the thin film layer based on the emissivity of the base surface and the coating layer and the intensity of the infrared spontaneous light that is measured on the flat target surface and converted into temperature, and a means for measuring the thickness of a thin film layer coated on a curved base surface, which outputs the thickness of the thin film layer while considering directional emissivity attributable to the materials of the base surface and the coating layer.