INTEGRATED ENDPOINT DETECTION SYSTEM WITH OPTICAL AND EDDY CURRENT MONITORING

摘要

Chemical mechanical polishing apparatus 20 and method can be used for the eddy current monitoring system 40 and optical monitoring 140. Signals from the monitoring system are combined at the output line can be extracted by a computer. It may be the thickness of the polishing pad 30 is calculated. Eddy current monitoring system 40 and optical monitoring system 140 can be measured in substantially the same position on the substrate.