Loading and unloading device for silicon wafer, has contact surface sloped relative to horizontal plane such that wafer with outer edges and/or transition surface between edges and plane surfaces of wafer only lies on contact surface

摘要

The device has three centering elements arranged along circumference of a circular path in distributed manner, and moving relative to the circular path in a radial direction by a centering device. A contact surface (6) of the centering elements is sloped relative to horizontal plane (10) such that a wafer (11) with outer edges (14) and/or a transition surface (13) between the edges and plane surfaces (12) of the workpiece only lies on the contact surface, where the workpiece is supported at the contact surface.