Production of thin chipboard comprises forming layer of chips coated with binder on conveyor belt, laying textile mat laid over this and applying second layer of coated chips, after which product is pressed with roller

摘要

The method for production of thin chipboard (10) comprises forming a layer (5) of chips (1) coated with binder on a conveyor belt (3). A textile mat (6) is laid over this and a second layer (8) of coated chips is applied. The product is then pressed with a roller (9). An independent claim is included for thin chipboard with an embedded textile mat.