首页> 外国专利> Producing a surface layer of a substrate e.g. ceramic electrode, comprises applying the surface layer on the substrate in an atmosphere of argon and oxygen by a sputter deposition, and setting the oxygen with oxygen partial pressure

Producing a surface layer of a substrate e.g. ceramic electrode, comprises applying the surface layer on the substrate in an atmosphere of argon and oxygen by a sputter deposition, and setting the oxygen with oxygen partial pressure

机译:生产基材的表面层,例如陶瓷电极,包括通过溅射沉积在氩气和氧气的气氛中将表面层施加在基板上,并用氧气分压设定氧气

摘要

The method for producing a surface layer of a substrate e.g. ceramic electrode, comprises applying the surface layer on the substrate in an atmosphere of argon and oxygen by a sputter deposition, setting the oxygen with a regulatable oxygen partial pressure for regulation, and adjusting a specific surface resistance of the surface layer by regulating the oxygen partial pressure. The oxygen is continuously supplied. The oxygen supply enables the regulation of the oxygen partial pressure of 0.5x 10 - 4torr to 1.5x 10 - 3torr. The sputter deposition on the substrate is carried out by a target. The method for producing a surface layer of a substrate e.g. ceramic electrode, comprises applying the surface layer on the substrate in an atmosphere of argon and oxygen by a sputter deposition, setting the oxygen with a regulatable oxygen partial pressure for regulation, and adjusting a specific surface resistance of the surface layer by regulating the oxygen partial pressure. The oxygen is continuously supplied. The oxygen supply enables the regulation of the oxygen partial pressure of 0.5x 10 - 4torr to 1.5x 10 - 3torr. The sputter deposition on the substrate is carried out by a target from tungsten (90%) and titanium (10%) for a time period of 2 seconds. The total pressure consists of the oxygen partial pressure and an argon partial pressure, and has a given first value of 5x 10 - 3mbar. The oxygen partial pressure is regulated to a second value and subsequently the argon partial pressure to a third value, up to which the first value of the total pressure is obtained. The distance of the target from the substrate is adjusted to 6 cm during the sputter deposition. The diameter of the target is 15-16 cm. A thickness of the surface layer is 1 mu m. The sputter deposition is carried out by a high frequency source with an operating voltage of 2kV. An independent claim is included for a surface layer of a substrate such as ceramic electrode.
机译:用于生产基底的表面层的方法例如陶瓷电极,包括通过溅射沉积在氩气和氧气的气氛中将表面层施加在基板上,以可调节的氧气分压调节氧气以进行调节,以及通过调节氧气分压来调节表面层的比表面电阻。压力。氧气被连续供应。氧气供应可将氧气分压从0.5x 10-> 4> torr调节到1.5x 10-> 3> torr。通过靶在基板上进行溅射沉积。用于生产基底的表面层的方法例如陶瓷电极,包括通过溅射沉积在氩气和氧气的气氛中将表面层施加在基板上,以可调节的氧气分压调节氧气以进行调节,以及通过调节氧气分压来调节表面层的比表面电阻。压力。氧气被连续供应。氧气供应可以将氧气分压从0.5x 10-> 4> torr调节到1.5x 10-> 3> torr。靶材上的钨(90%)和钛(10%)进行溅射沉积2秒。总压力由氧气分压和氩气分压组成,给定的第一值为5x 10-> 3> mbar。将氧气分压调节到第二值,然后将氩气分压调节到第三值,直至达到总压力的第一值。在溅射沉积过程中,靶材与基板的距离调整为6 cm。目标的直径是15-16厘米。表面层的厚度为1μm。溅射沉积由工作电压为2kV的高频源进行。对于诸如陶瓷电极的基底的表面层包括独立权利要求。

著录项

  • 公开/公告号DE102008004405A1

    专利类型

  • 公开/公告日2009-02-12

    原文格式PDF

  • 申请/专利权人 CARL ZEISS NTS GMBH;

    申请/专利号DE20081004405

  • 发明设计人 EISELE ANDREAS;DEYLE JOHANNES;

    申请日2008-01-14

  • 分类号C23C14/34;

  • 国家 DE

  • 入库时间 2022-08-21 19:09:18

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