首页> 外国专利> Printed circuit board for use in e.g. lighting device, has heat dissipating element arranged in through-hole, and radiation source i.e. LED, arranged on heat dissipating element, where heat dissipating element is electrically conductive

Printed circuit board for use in e.g. lighting device, has heat dissipating element arranged in through-hole, and radiation source i.e. LED, arranged on heat dissipating element, where heat dissipating element is electrically conductive

机译:印刷电路板,例如用于照明装置具有设置在通孔中的散热元件和布置在散热元件上的辐射源即LED,其中散热元件是导电的

摘要

The board (1) has a heat dissipating element (3) arranged in a through-hole (2), and a radiation source (6) i.e. LED, arranged on the heat dissipating element. The heat dissipating element is electrically conductive, and the radiation source is separated from the heat dissipating element by a heat conducting and electrically insulating layer (5), where the heat conducting and electrically insulating layer is implemented as a submount for the radiation source. The submount is pressed into the heat dissipating element.
机译:板(1)具有布置在通孔(2)中的散热元件(3),以及布置在散热元件上的辐射源(6),即LED。散热元件是导电的,并且辐射源通过导热和电绝缘层(5)与散热元件分开,其中,导热和电绝缘层被实现为辐射源的基座。基座被压入散热元件中。

著录项

  • 公开/公告号DE102008016458A1

    专利类型

  • 公开/公告日2009-10-01

    原文格式PDF

  • 申请/专利权人 OSRAM GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG;

    申请/专利号DE20081016458

  • 发明设计人 WEIS MICHAEL;STRAUS STEFFEN;

    申请日2008-03-31

  • 分类号H05K7/20;H05K1/02;F21V29/00;H01L23/34;H01L25/075;

  • 国家 DE

  • 入库时间 2022-08-21 19:09:12

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