首页> 外国专利> Structured electrically conductive metal layers producing method for use during production of electronic circuit utilized for e.g. smart label, involves removing solvent from connection and transferring connection into layer

Structured electrically conductive metal layers producing method for use during production of electronic circuit utilized for e.g. smart label, involves removing solvent from connection and transferring connection into layer

机译:结构化的导电金属层的生产方法,用于在生产例如用于电子电路的电子电路期间使用。智能标签,涉及从连接中除去溶剂并将连接转移到层中

摘要

The method involves providing an electrical isolating substrate with a foil made of polyethylene terephthalate. A metal-organic precursor-connection is provided and structured on the substrate, where the connection comprises silver neodecanoate. The connection is dissolved in a solvent and the solvent is removed from the metal-organic precursor connection, where the solvent comprises xylene, toluene or anisole. The metal-organic precursor connection is transferred into an electrically conductive metal layer under effect of atmosphere plasma that is produced using a plasma nozzle.
机译:该方法包括为电绝缘基板提供由聚对苯二甲酸乙二醇酯制成的箔。提供了一种金属-有机前体连接,并在基板上结构化,其中该连接包含新癸酸银。将连接溶解在溶剂中,并从金属-有机前体连接中除去溶剂,其中溶剂包含二甲苯,甲苯或苯甲醚。在使用等离子体喷嘴产生的大气等离子体的作用下,金属-有机前驱体连接被转移到导电金属层中。

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