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Structured electrically conductive metal layers producing method for use during production of electronic circuit utilized for e.g. smart label, involves removing solvent from connection and transferring connection into layer
Structured electrically conductive metal layers producing method for use during production of electronic circuit utilized for e.g. smart label, involves removing solvent from connection and transferring connection into layer
The method involves providing an electrical isolating substrate with a foil made of polyethylene terephthalate. A metal-organic precursor-connection is provided and structured on the substrate, where the connection comprises silver neodecanoate. The connection is dissolved in a solvent and the solvent is removed from the metal-organic precursor connection, where the solvent comprises xylene, toluene or anisole. The metal-organic precursor connection is transferred into an electrically conductive metal layer under effect of atmosphere plasma that is produced using a plasma nozzle.
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