Electronic component i.e. wafer, contacting method for e.g. measuring parameter, involves arranging components on substrate, where one selected component is contacted across contact surface on rear side lying opposite to front side

摘要

The method involves arranging two electronic components (3, 11) i.e. wafer, on a supporting substrate (2) i.e. plastic film. One of the selected electronic components (11) is subjected with a signal by a test probe (4) on a front side (9) turned away from the supporting substrate, or another signal is measured off. The substrate is electrically conductive and the selected electronic component is electrically contacted across a contact surface on a rear side (10) lying opposite to the front side over the substrate. The substrate is arranged on a planar surface. An independent claim is also included for a device for contacting of electronic components, comprising a supporting substrate.