Electrical module i.e. detector module, manufacturing method for X-ray measuring system of computer tomography scanner, involves soldering evaluation electronics of component with carrier substrate by low-temperature-guide

摘要

The method involves electrically, conductively connecting a semiconductor component (2) and evaluation electronics (3) together for formation of a component (5). The evaluation electronics of the component is soldered with a carrier substrate (4) by a low-temperature-guide in a reflow soldering process. The semiconductor component is connected with evaluation electronics by a soldered adhesive joint by a conductive adhesive for formation of the component. An intermediate space is filled between the evaluation electronics and the carrier substrate. An independent claim is also included for an electrical module with a component.