首页>
外国专利>
CURABLE RESIN COMPOSITION, CURED PRODUCT OF THE SAME, PRINTED WIRING SUBSTRATE, ESTER COMPOUND, AND ESTER-BASED RESIN AND METHOD FOR MANUFACTURING THE SAME
CURABLE RESIN COMPOSITION, CURED PRODUCT OF THE SAME, PRINTED WIRING SUBSTRATE, ESTER COMPOUND, AND ESTER-BASED RESIN AND METHOD FOR MANUFACTURING THE SAME
展开▼
机译:固化树脂组合物,相同产品的固化产品,印刷线路基板,酯化合物和基于酯的树脂及其制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
PROBLEM TO BE SOLVED: To provide a curable resin composition which has both excellent heat resistance and low dielectric constant and a low dissipation factor and furthermore which attains a good solvent dissolvability; a cured product of the same; a printed wiring substrate which has both heat resistance and a low dielectric constant and low dissipation factor; an ester compound to give these performance; and an ester-based resin and a method for manufacturing the same.;SOLUTION: This curable resin composition uses as the essential components an epoxy resin (A) and an ester-based resin (B) which has in the molecular structure a skeleton having a knot of a naphthalene structure and a cyclohexadienone structure via a methylene group and has an acyloxy group as a substituent group on the naphthalene structure.;COPYRIGHT: (C)2011,JPO&INPIT
展开▼