MEMS (MICROELECTROMECHANICAL SYSTEMS) MANUFACTURING METHOD AND MEMS

摘要

PROBLEM TO BE SOLVED: To provide an MEMS having high sensitivity and low temperature dependence.;SOLUTION: In this MEMS manufacturing method, a flexible section and a detecting means for detecting the deformation or displacement of the flexible section by processing two main faces of a silicon wafer from one side are formed; a second wafer made of a connection material of a thermal expansion coefficient close to that of the silicon wafer, as compared with a predetermined metal material is directly jointed to the other of the two main faces of the silicon wafer; the second wafer is etched to form an annular clearance; the connection section surrounded by the clearance and made of the connection material is formed; sacrificial films are formed on the other main face of the silicon wafer, appearing in the clearance and an end surface of the second wafer; and a spindle section made of the metallic material is formed by depositing the metallic material deposit on the surfaces of the connection section and the sacrificial film.;COPYRIGHT: (C)2010,JPO&INPIT