METHOD OF MANUFACTURING LEAD FRAME, LEAD FRAME, METHOD OF MANUFACTURING HEAT SINK, AND HEAT SINK

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a lead frame hardly causing release of sealing resin, and a lead frame manufactured by the method.;SOLUTION: In the method of manufacturing a lead frame for an IC package 2 which is manufactured by sealing a metallic lead frame and an IC chip with resin, a number of dimples of 2-30 μm in depth are provided at high density in a specific area D2 having two sides of the length of distance L2 of a corner part on the reverse surface of a die pad 11 of the lead frame, the dimple being formed by emitting laser beam with a wavelength of about 1 μm and an average output of several Watts to the same position several times to a few dozen times. According to this, a dimple having characteristics equal to etching treatment can be formed with extremely high productivity while suppressing thermal change of properties or deformation.;COPYRIGHT: (C)2010,JPO&INPIT